From 130aa61a77b8518f1ea618e1b7d214d60b405f10 Mon Sep 17 00:00:00 2001 From: Stephen Hemminger Date: Thu, 11 Jun 2009 05:46:04 -0700 Subject: [PATCH] bonding: fix multiple module load problem Some users still load bond module multiple times to create bonding devices. This accidentally was broken by a later patch about the time sysfs was fixed. According to Jay, it was broken by: commit b8a9787eddb0e4665f31dd1d64584732b2b5d051 Author: Jay Vosburgh Date: Fri Jun 13 18:12:04 2008 -0700 bonding: Allow setting max_bonds to zero Note: sysfs and procfs still produce WARN() messages when this is done so the sysfs method is the recommended API. Signed-off-by: Stephen Hemminger Signed-off-by: Jay Vosburgh Signed-off-by: David S. Miller --- drivers/net/bonding/bond_sysfs.c | 1 + 1 file changed, 1 insertion(+) diff --git a/drivers/net/bonding/bond_sysfs.c b/drivers/net/bonding/bond_sysfs.c index 3a1b7b04eb79..5fb861a08664 100644 --- a/drivers/net/bonding/bond_sysfs.c +++ b/drivers/net/bonding/bond_sysfs.c @@ -1541,6 +1541,7 @@ int bond_create_sysfs(void) printk(KERN_ERR "network device named %s already exists in sysfs", class_attr_bonding_masters.attr.name); + ret = 0; } return ret; -- 2.20.1