From: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Date: Fri, 26 Mar 2010 14:37:14 +0000 (+0300)
Subject: USB: OHCI: DA8xx/OMAP-L1x: fix up macro rename
X-Git-Url: https://git.stricted.de/?a=commitdiff_plain;h=9600cbb24b3937dc6ebf470211d8908354ca3b0c;p=GitHub%2Fexynos8895%2Fandroid_kernel_samsung_universal8895.git

USB: OHCI: DA8xx/OMAP-L1x: fix up macro rename

It appears that the DA8xx/OMAP-L1x glue layer went into the kernel uncompilable:
commit 1960e693ac12ae5fe518309d6a63a44c93fad9e7 (davinci: da8xx/omapl1: add
support for the second sysconfig module) has renamed DA8XX_SYSCFG_* macros to
DA8XX_SYSCFG0_* and it's been committed before the glue layer...

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
---

diff --git a/drivers/usb/host/ohci-da8xx.c b/drivers/usb/host/ohci-da8xx.c
index 4aa08d36d077..d22fb4d577b7 100644
--- a/drivers/usb/host/ohci-da8xx.c
+++ b/drivers/usb/host/ohci-da8xx.c
@@ -23,7 +23,7 @@
 #error "This file is DA8xx bus glue.  Define CONFIG_ARCH_DAVINCI_DA8XX."
 #endif
 
-#define CFGCHIP2	DA8XX_SYSCFG_VIRT(DA8XX_CFGCHIP2_REG)
+#define CFGCHIP2	DA8XX_SYSCFG0_VIRT(DA8XX_CFGCHIP2_REG)
 
 static struct clk *usb11_clk;
 static struct clk *usb20_clk;