From: Stephen Hemminger <shemminger@vyatta.com>
Date: Thu, 11 Jun 2009 12:46:04 +0000 (-0700)
Subject: bonding: fix multiple module load problem
X-Git-Url: https://git.stricted.de/?a=commitdiff_plain;h=130aa61a77b8518f1ea618e1b7d214d60b405f10;p=GitHub%2Fmt8127%2Fandroid_kernel_alcatel_ttab.git

bonding: fix multiple module load problem

Some users still load bond module multiple times to create bonding
devices.  This accidentally was broken by a later patch about
the time sysfs was fixed.  According to Jay, it was broken
by:
   commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
   Author: Jay Vosburgh <fubar@us.ibm.com>
   Date:   Fri Jun 13 18:12:04 2008 -0700

     bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.

Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
---

diff --git a/drivers/net/bonding/bond_sysfs.c b/drivers/net/bonding/bond_sysfs.c
index 3a1b7b04eb79..5fb861a08664 100644
--- a/drivers/net/bonding/bond_sysfs.c
+++ b/drivers/net/bonding/bond_sysfs.c
@@ -1541,6 +1541,7 @@ int bond_create_sysfs(void)
 			printk(KERN_ERR
 			       "network device named %s already exists in sysfs",
 			       class_attr_bonding_masters.attr.name);
+		ret = 0;
 	}
 
 	return ret;