Vlad Yasevich says:
====================
Fixed stacked vlan usage on top of bonds
Bonding device driver now support q-in-q on top for bonds. There are
a few issues here though.
First, when arp monitoring is used, bonding driver will not correctly
tag traffic if the source of the arp device was configured on top of
q-in-q. It may also incorrectly pick the wrong vlan id if the ordering
of that upper devices isn't as expected (there is no guarntee on ordering).
Second, the alb/tlb may use what would be considered 'inner' vlans in
its learning announcements, as it simply announces all vlans configured
on top of the bond without regard for encapsulation/stacking.
This series fixes the above 2 issues. This series also depends on the
functionality introduced in
http://patchwork.ozlabs.org/patch/349766/
Since v1:
- Changed how patch1 verifies the device path. We no longer use the
_all_upper version of the function. We find the path and if it was
found, then collect the vlan information.
- Use the constant to devine maximum vlan nest level support on top
of bonding. This can be changed if 2 is too low.
- Inlude patch2 into the series.
====================
Signed-off-by: David S. Miller <davem@davemloft.net>