[COMMON] thermal: fix build error
authorEunseok Choi <es10.choi@samsung.com>
Tue, 9 May 2017 10:03:50 +0000 (19:03 +0900)
committerChungwoo Park <cww.park@samsung.com>
Mon, 21 May 2018 08:22:22 +0000 (17:22 +0900)
Change-Id: I8e53bd09d42af5f300bffc5bc8c529a7165db3a7
Signed-off-by: Eunseok Choi <es10.choi@samsung.com>
include/linux/cpu_cooling.h

index 037e212da5f2c7bdf595c67d7e9fbc18a9a11130..23a94959c10d10c2815b59bc28fd1c49fd5d9020 100644 (file)
@@ -166,7 +166,7 @@ of_cpufreq_power_cooling_register(struct device_node *np,
 }
 
 static inline struct thermal_cooling_device *
-exynos_cpufreq_cooling_register(const struct cpumask *clip_cpus);
+exynos_cpufreq_cooling_register(const struct cpumask *clip_cpus)
 {
        return NULL;
 }