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(parent: 2c4cbe6) | patch
usb: dwc3: add ST dwc3 glue layer to manage dwc3 HC
authorPeter Griffin <peter.griffin@linaro.org>
Fri, 5 Sep 2014 15:36:30 +0000 (16:36 +0100)
committerFelipe Balbi <balbi@ti.com>
Fri, 5 Sep 2014 15:49:00 +0000 (10:49 -0500)
commitf83fca0707c66e36f14efef7f68702cb12de70b7
treecf77fb9bb2d9239ae49af8f7b456e048242b239dtree | snapshot (tar.gz zip)
parent2c4cbe6e5a9c71408b496e00a78ea9284e98af16commit | diff
usb: dwc3: add ST dwc3 glue layer to manage dwc3 HC

This patch adds the ST glue logic to manage the DWC3 HC
on STiH407 SoC family. It manages the powerdown signal,
and configures the internal glue logic and syscfg registers.

[ balbi@ti.com : actually switch over to of_platform_depopulate() ]

Signed-off-by: Giuseppe Cavallaro <peppe.cavallaro@st.com>
Signed-off-by: Peter Griffin <peter.griffin@linaro.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Felipe Balbi <balbi@ti.com>
drivers/usb/dwc3/Kconfig diff | blob | blame | history
drivers/usb/dwc3/Makefile diff | blob | blame | history
drivers/usb/dwc3/dwc3-st.c [new file with mode: 0644] blob