thermal: Bind cooling devices with the correct arguments
authorPunit Agrawal <punit.agrawal@arm.com>
Tue, 3 Jun 2014 09:59:58 +0000 (10:59 +0100)
committerZhang Rui <rui.zhang@intel.com>
Mon, 30 Jun 2014 02:20:27 +0000 (10:20 +0800)
commitdd354b84d47ec8ca53686bdb3cc1aecdeb75bef5
treefab1eb7735d8d3c24639f0d32204e032742f8c30
parentca9521b770c988bb6bb8eea1241f7a487dab6ff1
thermal: Bind cooling devices with the correct arguments

When binding cooling devices to thermal zones created from the device
tree the minimum and maximum cooling states are in the wrong order
leading to failure to bind.

Fix the order of cooling states in the call to
thermal_zone_bind_cooling_device to fix this.

Cc:Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Reviewed-by: Stephen Boyd <sboyd@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
drivers/thermal/of-thermal.c