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(parent: f6bafc6) | patch
usb: dwc3: Add Exynos Specific Glue layer
authorAnton Tikhomirov <av.tikhomirov@samsung.com>
Wed, 15 Feb 2012 08:04:56 +0000 (17:04 +0900)
committerFelipe Balbi <balbi@ti.com>
Fri, 2 Mar 2012 10:11:28 +0000 (12:11 +0200)
commitd28a9689c93195d39f91f35a9519876688605b65
tree39d7c0b3f80657039cefc3996c20010bdbabbed0tree | snapshot (tar.gz zip)
parentf6bafc6a1c9d58f0c234ac5052b9c09b0747348ccommit | diff
usb: dwc3: Add Exynos Specific Glue layer

Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.

[ balbi@ti.com : prevent compilation of Exynos glue layer
on platforms which don't provide clk API implementation ]

Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
drivers/usb/dwc3/Makefile diff | blob | blame | history
drivers/usb/dwc3/dwc3-exynos.c [new file with mode: 0644] blob
include/linux/platform_data/dwc3-exynos.h [new file with mode: 0644] blob