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(parent: 3a7129e) | patch
bonding: ust micro BOND_NO_USE_ARP to simplify the mode check
authordingtianhong <dingtianhong@huawei.com>
Sat, 21 Dec 2013 06:40:17 +0000 (14:40 +0800)
committerDavid S. Miller <davem@davemloft.net>
Tue, 31 Dec 2013 05:40:31 +0000 (00:40 -0500)
commit834db4bcdf937b9f06122a633672ee5acd77085b
tree5f0df724b448a7f856b791b6a62db1334126005atree | snapshot (tar.gz zip)
parent3a7129e52766f015f0d4035ac9c7c9408829b9a1commit | diff
bonding: ust micro BOND_NO_USE_ARP to simplify the mode check

The bond 3ad and TLB/ALB has the same check path, so combine them.

Signed-off-by: Ding Tianhong <dingtianhong@huawei.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
drivers/net/bonding/bond_main.c diff | blob | blame | history