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(parent: 16bd6b4) | patch
thermal: cpu_cooling: Move cpufreq_cooling_device structure to header file.
authorPark Chungwoo <cww.park@samsung.com>
Tue, 15 Mar 2016 07:54:50 +0000 (16:54 +0900)
committerChungwoo Park <cww.park@samsung.com>
Mon, 21 May 2018 08:09:11 +0000 (17:09 +0900)
commit78514a54b55fd14b3ba1e56bd3a60f5d4eff1e32
tree4017f1c7300544442ca25923f81cb75a89c99713tree | snapshot (tar.gz zip)
parent16bd6b455c06cab7a92453abd7be0cc2171e6a39commit | diff
thermal: cpu_cooling: Move cpufreq_cooling_device structure to header file.

Resolved migration conflicts from kernel 4.9 to 4.14.

Change-Id: I4d694ace63149e5935d6d5d7d421ac5f7ad002e1
Signed-off-by: Park Chungwoo <cww.park@samsung.com>
Signed-off-by: Hyeonseong Gil <hs.gil@samsung.com>
Signed-off-by: Eunseok Choi <es10.choi@samsung.com>
drivers/thermal/cpu_cooling.c diff | blob | blame | history
include/linux/cpu_cooling.h diff | blob | blame | history