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remoteproc: wcnss: Bond SMD edge to remoteproc
authorBjorn Andersson <bjorn.andersson@linaro.org>
Thu, 20 Oct 2016 02:40:04 +0000 (19:40 -0700)
committerBjorn Andersson <bjorn.andersson@linaro.org>
Tue, 15 Nov 2016 05:52:14 +0000 (21:52 -0800)
commit5a856bc63ce9e19668b452a699833c523cec5f40
treeadd1ceb3571a7456d1ce6f22414e788960ea5593tree | snapshot (tar.gz zip)
parent8fc947230fbc5da1d6d198c758b894f847bf2a28commit | diff
remoteproc: wcnss: Bond SMD edge to remoteproc

Allow the wcnss smd edge to be described as a child of the wcnss
remoteproc node and make the edge life cycle follow the running state of
the remoteproc.

This bond is necessary to clean up the smd state when the remote
processor is suddenly removed, and in some cases even when it shut down
in a controlled fasion.

Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
drivers/remoteproc/qcom_wcnss.c diff | blob | blame | history