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(parent: 1cfc06e) | patch
thermal: cpu_cooling: Change cooling device node
authorHyeonseong Gil <hs.gil@samsung.com>
Mon, 18 Sep 2017 02:15:54 +0000 (11:15 +0900)
committerChungwoo Park <cww.park@samsung.com>
Mon, 21 May 2018 08:22:23 +0000 (17:22 +0900)
commit4a1872ef071c3dbc5bcff6b3750fc61130af0cd6
treefa9761f07ccf660446108eca7e9fd3f10a047aa3tree | snapshot (tar.gz zip)
parent1cfc06e4c6d101ca40236a535ea4e87952e56cfacommit | diff
thermal: cpu_cooling: Change cooling device node

Previously, CPU device node was used to register the cooling device.
We chanaged to use the cpufreq device node for registration
even if the specific CPU was turned off.

Change-Id: I7e6e76fe38a2d05a9968290adb080d85712a5afd
Signed-off-by: Hyeonseong Gil <hs.gil@samsung.com>
drivers/thermal/cpu_cooling.c diff | blob | blame | history
include/linux/cpu_cooling.h diff | blob | blame | history