projects / GitHub / exynos8895 / android_kernel_samsung_universal8895.git / commit
? search:
summary | shortlog | log | commit | commitdiff | tree
(parent: f9577a3) | patch
bonding: clean up style for bond_3ad.c
authorVeaceslav Falico <vfalico@redhat.com>
Wed, 8 Jan 2014 15:46:46 +0000 (16:46 +0100)
committerDavid S. Miller <davem@davemloft.net>
Sun, 12 Jan 2014 22:39:55 +0000 (14:39 -0800)
commit3bf2d28a2d7112bdae851f420b9f2386b3fb362a
tree6f19e51cb545b4bd2c8dac2adf389c7cfe94dffatree | snapshot (tar.gz zip)
parentf9577a376e28d7b8367319e103d6511d41c1c5facommit | diff
bonding: clean up style for bond_3ad.c

It's a huge mess currently, that is really hard to read. This cleanup
doesn't touch the logic at all, it only breaks easy-to-fix long lines and
updates comment styles.

CC: Jay Vosburgh <fubar@us.ibm.com>
CC: Andy Gospodarek <andy@greyhouse.net>
Signed-off-by: Veaceslav Falico <vfalico@redhat.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
drivers/net/bonding/bond_3ad.c diff | blob | blame | history