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Thermal: rename structure thermal_cooling_device_instance to thermal_instance
authorZhang Rui <rui.zhang@intel.com>
Wed, 27 Jun 2012 02:08:19 +0000 (10:08 +0800)
committerZhang Rui <rui.zhang@intel.com>
Mon, 24 Sep 2012 06:44:37 +0000 (14:44 +0800)
commitb81b6ba3d9ac5feb14388bb73ac5a39d9a7540dc
tree02dfdca3257a5540c1d20b8d5ed460bb56b403c8tree | snapshot (tar.gz zip)
parent4ae46befb49d4173122e0afa995c4e93d01948a2commit | diff
Thermal: rename structure thermal_cooling_device_instance to thermal_instance

This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.

thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
drivers/thermal/thermal_sys.c diff | blob | blame | history
kernel source for telekom puls (alcatel/mediatek)