Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/aegl/linux-2.6
[GitHub/mt8127/android_kernel_alcatel_ttab.git] / Documentation / thermal / sysfs-api.txt
1 Generic Thermal Sysfs driver How To
2 =========================
3
4 Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
5
6 Updated: 2 January 2008
7
8 Copyright (c) 2008 Intel Corporation
9
10
11 0. Introduction
12
13 The generic thermal sysfs provides a set of interfaces for thermal zone devices (sensors)
14 and thermal cooling devices (fan, processor...) to register with the thermal management
15 solution and to be a part of it.
16
17 This how-to focuses on enabling new thermal zone and cooling devices to participate
18 in thermal management.
19 This solution is platform independent and any type of thermal zone devices and
20 cooling devices should be able to make use of the infrastructure.
21
22 The main task of the thermal sysfs driver is to expose thermal zone attributes as well
23 as cooling device attributes to the user space.
24 An intelligent thermal management application can make decisions based on inputs
25 from thermal zone attributes (the current temperature and trip point temperature)
26 and throttle appropriate devices.
27
28 [0-*] denotes any positive number starting from 0
29 [1-*] denotes any positive number starting from 1
30
31 1. thermal sysfs driver interface functions
32
33 1.1 thermal zone device interface
34 1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, int trips,
35 void *devdata, struct thermal_zone_device_ops *ops)
36
37 This interface function adds a new thermal zone device (sensor) to
38 /sys/class/thermal folder as thermal_zone[0-*].
39 It tries to bind all the thermal cooling devices registered at the same time.
40
41 name: the thermal zone name.
42 trips: the total number of trip points this thermal zone supports.
43 devdata: device private data
44 ops: thermal zone device call-backs.
45 .bind: bind the thermal zone device with a thermal cooling device.
46 .unbind: unbind the thermal zone device with a thermal cooling device.
47 .get_temp: get the current temperature of the thermal zone.
48 .get_mode: get the current mode (user/kernel) of the thermal zone.
49 "kernel" means thermal management is done in kernel.
50 "user" will prevent kernel thermal driver actions upon trip points
51 so that user applications can take charge of thermal management.
52 .set_mode: set the mode (user/kernel) of the thermal zone.
53 .get_trip_type: get the type of certain trip point.
54 .get_trip_temp: get the temperature above which the certain trip point
55 will be fired.
56
57 1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
58
59 This interface function removes the thermal zone device.
60 It deletes the corresponding entry form /sys/class/thermal folder and unbind all
61 the thermal cooling devices it uses.
62
63 1.2 thermal cooling device interface
64 1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name,
65 void *devdata, struct thermal_cooling_device_ops *)
66
67 This interface function adds a new thermal cooling device (fan/processor/...) to
68 /sys/class/thermal/ folder as cooling_device[0-*].
69 It tries to bind itself to all the thermal zone devices register at the same time.
70 name: the cooling device name.
71 devdata: device private data.
72 ops: thermal cooling devices call-backs.
73 .get_max_state: get the Maximum throttle state of the cooling device.
74 .get_cur_state: get the Current throttle state of the cooling device.
75 .set_cur_state: set the Current throttle state of the cooling device.
76
77 1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
78
79 This interface function remove the thermal cooling device.
80 It deletes the corresponding entry form /sys/class/thermal folder and unbind
81 itself from all the thermal zone devices using it.
82
83 1.3 interface for binding a thermal zone device with a thermal cooling device
84 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
85 int trip, struct thermal_cooling_device *cdev);
86
87 This interface function bind a thermal cooling device to the certain trip point
88 of a thermal zone device.
89 This function is usually called in the thermal zone device .bind callback.
90 tz: the thermal zone device
91 cdev: thermal cooling device
92 trip: indicates which trip point the cooling devices is associated with
93 in this thermal zone.
94
95 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
96 int trip, struct thermal_cooling_device *cdev);
97
98 This interface function unbind a thermal cooling device from the certain trip point
99 of a thermal zone device.
100 This function is usually called in the thermal zone device .unbind callback.
101 tz: the thermal zone device
102 cdev: thermal cooling device
103 trip: indicates which trip point the cooling devices is associated with
104 in this thermal zone.
105
106 2. sysfs attributes structure
107
108 RO read only value
109 RW read/write value
110
111 Thermal sysfs attributes will be represented under /sys/class/thermal.
112 Hwmon sysfs I/F extension is also available under /sys/class/hwmon
113 if hwmon is compiled in or built as a module.
114
115 Thermal zone device sys I/F, created once it's registered:
116 /sys/class/thermal/thermal_zone[0-*]:
117 |-----type: Type of the thermal zone
118 |-----temp: Current temperature
119 |-----mode: Working mode of the thermal zone
120 |-----trip_point_[0-*]_temp: Trip point temperature
121 |-----trip_point_[0-*]_type: Trip point type
122
123 Thermal cooling device sys I/F, created once it's registered:
124 /sys/class/thermal/cooling_device[0-*]:
125 |-----type : Type of the cooling device(processor/fan/...)
126 |-----max_state: Maximum cooling state of the cooling device
127 |-----cur_state: Current cooling state of the cooling device
128
129
130 These two dynamic attributes are created/removed in pairs.
131 They represent the relationship between a thermal zone and its associated cooling device.
132 They are created/removed for each
133 thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device successful execution.
134
135 /sys/class/thermal/thermal_zone[0-*]
136 |-----cdev[0-*]: The [0-*]th cooling device in the current thermal zone
137 |-----cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
138
139 Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
140 the generic thermal driver also creates a hwmon sysfs I/F for each _type_ of
141 thermal zone device. E.g. the generic thermal driver registers one hwmon class device
142 and build the associated hwmon sysfs I/F for all the registered ACPI thermal zones.
143 /sys/class/hwmon/hwmon[0-*]:
144 |-----name: The type of the thermal zone devices.
145 |-----temp[1-*]_input: The current temperature of thermal zone [1-*].
146 |-----temp[1-*]_critical: The critical trip point of thermal zone [1-*].
147 Please read Documentation/hwmon/sysfs-interface for additional information.
148
149 ***************************
150 * Thermal zone attributes *
151 ***************************
152
153 type Strings which represent the thermal zone type.
154 This is given by thermal zone driver as part of registration.
155 Eg: "acpitz" indicates it's an ACPI thermal device.
156 In order to keep it consistent with hwmon sys attribute,
157 this should be a short, lowercase string,
158 not containing spaces nor dashes.
159 RO
160 Required
161
162 temp Current temperature as reported by thermal zone (sensor)
163 Unit: millidegree Celsius
164 RO
165 Required
166
167 mode One of the predefined values in [kernel, user]
168 This file gives information about the algorithm
169 that is currently managing the thermal zone.
170 It can be either default kernel based algorithm
171 or user space application.
172 RW
173 Optional
174 kernel = Thermal management in kernel thermal zone driver.
175 user = Preventing kernel thermal zone driver actions upon
176 trip points so that user application can take full
177 charge of the thermal management.
178
179 trip_point_[0-*]_temp The temperature above which trip point will be fired
180 Unit: millidegree Celsius
181 RO
182 Optional
183
184 trip_point_[0-*]_type Strings which indicate the type of the trip point
185 E.g. it can be one of critical, hot, passive,
186 active[0-*] for ACPI thermal zone.
187 RO
188 Optional
189
190 cdev[0-*] Sysfs link to the thermal cooling device node where the sys I/F
191 for cooling device throttling control represents.
192 RO
193 Optional
194
195 cdev[0-*]_trip_point The trip point with which cdev[0-*] is associated in this thermal zone
196 -1 means the cooling device is not associated with any trip point.
197 RO
198 Optional
199
200 ******************************
201 * Cooling device attributes *
202 ******************************
203
204 type String which represents the type of device
205 eg: For generic ACPI: this should be "Fan",
206 "Processor" or "LCD"
207 eg. For memory controller device on intel_menlow platform:
208 this should be "Memory controller"
209 RO
210 Required
211
212 max_state The maximum permissible cooling state of this cooling device.
213 RO
214 Required
215
216 cur_state The current cooling state of this cooling device.
217 the value can any integer numbers between 0 and max_state,
218 cur_state == 0 means no cooling
219 cur_state == max_state means the maximum cooling.
220 RW
221 Required
222
223 3. A simple implementation
224
225 ACPI thermal zone may support multiple trip points like critical/hot/passive/active.
226 If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time,
227 it may register itself as a thermal_zone_device (thermal_zone1) with 4 trip points in all.
228 It has one processor and one fan, which are both registered as thermal_cooling_device.
229 If the processor is listed in _PSL method, and the fan is listed in _AL0 method,
230 the sys I/F structure will be built like this:
231
232 /sys/class/thermal:
233
234 |thermal_zone1:
235 |-----type: acpitz
236 |-----temp: 37000
237 |-----mode: kernel
238 |-----trip_point_0_temp: 100000
239 |-----trip_point_0_type: critical
240 |-----trip_point_1_temp: 80000
241 |-----trip_point_1_type: passive
242 |-----trip_point_2_temp: 70000
243 |-----trip_point_2_type: active0
244 |-----trip_point_3_temp: 60000
245 |-----trip_point_3_type: active1
246 |-----cdev0: --->/sys/class/thermal/cooling_device0
247 |-----cdev0_trip_point: 1 /* cdev0 can be used for passive */
248 |-----cdev1: --->/sys/class/thermal/cooling_device3
249 |-----cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
250
251 |cooling_device0:
252 |-----type: Processor
253 |-----max_state: 8
254 |-----cur_state: 0
255
256 |cooling_device3:
257 |-----type: Fan
258 |-----max_state: 2
259 |-----cur_state: 0
260
261 /sys/class/hwmon:
262
263 |hwmon0:
264 |-----name: acpitz
265 |-----temp1_input: 37000
266 |-----temp1_crit: 100000