include cleanup: Update gfp.h and slab.h includes to prepare for breaking implicit...
[GitHub/mt8127/android_kernel_alcatel_ttab.git] / drivers / input / misc / winbond-cir.c
CommitLineData
e258b80e
DH
1/*
2 * winbond-cir.c - Driver for the Consumer IR functionality of Winbond
3 * SuperI/O chips.
4 *
5 * Currently supports the Winbond WPCD376i chip (PNP id WEC1022), but
6 * could probably support others (Winbond WEC102X, NatSemi, etc)
7 * with minor modifications.
8 *
9